GenCut GL100E & 100 Series low speed advanced automatic precision cut-off saw is well established in the metallography industry. This diamond saw precision cutter is a perfect fit for cutting and sectioning a wide variety of small and delicate samples particularly when the material structure is not homogeneous. This precision cut off saw can accept cutting a cutting wheel of 4”.
GL100E Series metallographic precision cutter has variable speed control from 50-1000 rpm.. Additionally, GenCut GL 100E cut off saw for metallographic sample preparation comes standard with an automatic shut-off function at the end of each cutting cycle.
Model |
GenCut GL100E |
Cutting Wheel |
Ø200xØ32x0.9mm |
Motor |
300W |
Variable Speed |
100-1500rpm |
Cooling Device |
Automatic cycle cooling of cutting fluid (the cutting wheel drives the circulation of the water in the tank to cool down) |
Display Panel |
7" Touch Screen Controller |
Micrometer Travel Range |
0-25mm |
Position Accuracy |
0.01mm |
Power Supply |
Single phase, AC220V, 50Hz |
Emergency brake
|
Emergency stop switch |
Loading weights |
0-450g |
Dimensions |
21.65" x 21.65" x 14.96" / 550 x 550 x 380 mm |
Weight |
100lbs / 45kg |
Cutting Saw
Single Head Jig
Double Head Jig
Irregular Sample Jig
Flat Clamp
Water Drop Jig
Wrench for Changing Blade
Differential Head
Inset Sample Jig
Power Cord and Operation Manual
Two Cutting Modes – Manual or Gravity (weight, counterweight)
Digital Touch Screen Control with programmable menu structure for a user-friendly operating experience
Precision cutting off with micrometer head control
Closed transparent protective cover and safety switch provide protection for operators
Features a weight sliding loading system to minimize sample damage
Closed loop control cutting to prevent overload of the motor
Automatically stops after finishing the cut
Built-in Movable Coolant Tank
Compact body, small footprint and convenient operation and maintenance
Suitable for cutting small, soft, brittle, special-shaped metal materials, composite materials, plastics, electronic components, biological materials, ceramics, cement, rocks and minerals, etc. It is also commonly used for thin-film sample preparation.
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